Harman

What You Will Do

• Reviews BU request and cooperate with cross function to develop new headphone
• Responsible for the overall architecture: EE component selection, Acoustic package and Software features for headphone
• Responsible for Cloud and App architecture  for Headphone
• Taking lead on the new process, innovation, IP patenting and new standard development
• Provides direct as needed on-site interface with suppliers and sub-supplier program management, engineering, and manufacturing groups.
• Covers multiple design and manufacturers as required.
• Responsible for overseeing suppliers detail design and methods to ensure compliance with our product goals and quality testing procedures.
• Carry out feasibility study on new products against requirements, assist in defining a feasible architecture/concept and create a realistic development plan
• Lead the team of 2-3 to achieve assigned design goal in time
• Train and coach junior engineers to achieve high level of technical competence.
• Work with chipset and ecosystem partners like Google, Amazon, Apple, Tencent to understand their roadmap and see how to bring them into Harman product roadmap
• Work on platform strategy for Headphones to minimize risk and maximize output and time to market
• Proactively address architectural challenges through problem-solving session with a cross-functional team
• Timely escalation to senior management team when there is a major issue that would significantly impact program schedule, cost and quality 
• Communicate very clearly and succinctly (in English) to internal and external stakeholders on all technical and non-technical issues to persuade and influence with the goal to help remove execution barrier for the R&D Team
• Constantly keep assessing the Chipset Lead time  and availability to mitigate the risk and make a Plan-B

What You Need

• Minimum of bachelor’s degree in electronics, software or acoustics  (or appropriate graduation)
• 15+ years of consumer electrical product engineering and development experience
• Acoustic or ANC experience in headphone industry is preferable
• Experience in the RF design for wearable product
• Familiar with electronic schematic capture, layout and electronic simulation software tools
• Familiar with IEC, EIA, EIAJ formats and UL, CSA, IEC safety standards
• Familiar with antenna simulation, design, tuning and validation and cross body RF test
• Good verbal and written communications skills, including technical documentation using Microsoft Office, Word, Excel, Power Point and Outlook
• Ability of teamwork
• Good knowledge in spoken and written English
• Ability to work under pressure

What is Nice to Have

• Experience in integrating and troubleshooting DSP audio is a plus
• Open Minded and willing to work outside the box
• Honest and understands the value in reporting both good and bad news
• Schedule driven
• Innovative and willing to take calculated risks
• Able to work with aggressive goals on multiple programs
• Self-Motivated to be the best he/she can be

What Makes You Eligible

• Willingness to travel.
• Willingness to work in an office.
• Any offer of employment is conditioned upon the successful completion of a background investigation and drug screen.

What We Offer

• Flexible work environment
• Access to employee discounts on world-class Harman and Samsung products (JBL, HARMAN Kardon, AKG, etc.)
• Extensive training opportunities through our own HARMAN University
• Competitive wellness benefits
• Access to HARMAN Campus Fitness Center and Cafeteria
• An inclusive and diverse work environment that fosters and encourages professional and personal development