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基本信息

地点:
Shenzhen - Guangdong, China
职位类别:
工程研发
员工类型参考:
Regular - Permanent
工资标准类型:
受薪雇员
Career Level:
T4
Job ID:
R-41395-2025

描述和要求

What You Will Do

  • Reviews BU request and cooperate with cross function to develop new headphone
  • Responsible for the overall architecture: EE component selection, Acoustic package and Software features for headphone
  • Responsible for Cloud and App architecture  for Headphone
  • Taking lead on the new process, innovation, IP patenting and new standard development
  • Provides direct as needed on-site interface with suppliers and sub-supplier program management, engineering, and manufacturing groups.
  • Covers multiple design and manufacturers as required.
  • Responsible for overseeing suppliers detail design and methods to ensure compliance with our product goals and quality testing procedures.
  • Carry out feasibility study on new products against requirements, assist in defining a feasible architecture/concept and create a realistic development plan
  • Lead the team of 2-3 to achieve assigned design goal in time
  • Train and coach junior engineers to achieve high level of technical competence.
  • Work with chipset and ecosystem partners like Google, Amazon, Apple, Tencent to understand their roadmap and see how to bring them into Harman product roadmap
  • Work on platform strategy for Headphones to minimize risk and maximize output and time to market
  • Proactively address architectural challenges through problem-solving session with a cross-functional team
  • Timely escalation to senior management team when there is a major issue that would significantly impact program schedule, cost and quality 
  • Communicate very clearly and succinctly (in English) to internal and external stakeholders on all technical and non-technical issues to persuade and influence with the goal to help remove execution barrier for the R&D Team
  • Constantly keep assessing the Chipset Lead time  and availability to mitigate the risk and make a Plan-B

What You Need

  • Minimum of bachelor’s degree in electronics, software or acoustics  (or appropriate graduation)
  • 15+ years of consumer electrical product engineering and development experience
  • Acoustic or ANC experience in headphone industry is preferable
  • Experience in the RF design for wearable product
  • Familiar with electronic schematic capture, layout and electronic simulation software tools
  • Familiar with IEC, EIA, EIAJ formats and UL, CSA, IEC safety standards
  • Familiar with antenna simulation, design, tuning and validation and cross body RF test
  • Good verbal and written communications skills, including technical documentation using Microsoft Office, Word, Excel, Power Point and Outlook
  • Ability of teamwork
  • Good knowledge in spoken and written English
  • Ability to work under pressure

What is Nice to Have

  • Experience in integrating and troubleshooting DSP audio is a plus
  • Open Minded and willing to work outside the box
  • Honest and understands the value in reporting both good and bad news
  • Schedule driven
  • Innovative and willing to take calculated risks
  • Able to work with aggressive goals on multiple programs
  • Self-Motivated to be the best he/she can be

What Makes You Eligible

  • Willingness to travel.
  • Willingness to work in an office.
  • Any offer of employment is conditioned upon the successful completion of a background investigation and drug screen.

What We Offer

  • Flexible work environment
  • Access to employee discounts on world-class Harman and Samsung products (JBL, HARMAN Kardon, AKG, etc.)
  • Extensive training opportunities through our own HARMAN University
  • Competitive wellness benefits
  • Access to HARMAN Campus Fitness Center and Cafeteria
  • An inclusive and diverse work environment that fosters and encourages professional and personal development

哈曼致力于成为创造多样性、公平性和包容性的雇主。哈曼为所有符合条件的申请人提供平等的就业机会,不会因为种族、宗教、肤色、民族、性别(包括怀孕、分娩或相关医疗条件)、性取向、性别认同、性别表达、年龄、受保护退伍军人身份、残障或其他受法律保护的方面而受到歧视。